„Thermal Grizzly Minus Pad Extreme“ – 120 × 20 × 0,5 mm

The  Thermal Grizzly Minus Pad Extreme  is an excellent choice for applications where thermal paste is not suitable due to its cumbersome application. This is particularly useful when gaps between the heat source and the heatsink need to be bridged - for example, with memory chips and voltage regulators. The silicone-based thermal pad has a consistency similar to modelling paste. This allows for ideal surface design with maximum possible compression. The thermal conductivity has been improved by approximately 260% compared to the Minus Pad 8, enabling the best performance for challenging cooling processes such as voltage regulators and memory ICs. The Minus Pad Extreme is available in various sizes and thicknesses - here  120 x 20 x 0.5 mm . The pads perform excellently even with very low contact pressure, and the thermal conductivity is only slightly affected by the thickness. The choice of thickness should therefore depend entirely on the gap to be bridged. The Minus Pad Extreme is electrically insulating. Due to its consistency, only a single use is recommended. Attention!  This product comes with a protective film that must be removed before installation. We accept no liability for damage caused by improper or incorrect assembly and misuse!